C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3027, 400/49
C08L 51/06 (2006.01) B32B 7/12 (2006.01) B32B 13/12 (2006.01) C08L 23/12 (2006.01) C08L 53/00 (2006.01)
Patent
CA 1210884
Abstract of Disclosures Disclosed is a bonding resin composition composed of a blend consisting essentially of (a) maleic anhydride-modified, stereoregular polypropylene having a combined maleic anhydride content of about 0.5-0.8% by weight of said modified polypropylene, and (b) base polymer material at about 25 parts by weight per part by weight of said maleic anhydride-modified polypropylene. The base polymer material is selected from a group of two combinations. One combination consisting essentially of stereoregular polypropylene and essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 25% by weight of the product. The weight ratio of the polypropylene to the product is about 1:3-3:1. The other combination consists essentially of essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 7% by weight of the product, and essentially crystalline, sequentially polymerized propylene-ethylene product having a combined ethylene content of about 25% by weight of the product. The weight ratio of the two products is about 1:3-3:1. Also disclosed is a laminate of the bonding resin composition and a metal such as steel or aluminum. Further disclosed is a method for making the laminate.
434746
Fetherstonhaugh & Co.
Hercules Incorporated
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