C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
117/151, 204/36,
C08J 5/12 (2006.01)
Patent
CA 1068179
ABSTRACT OF THE DISCLOSURE An improved process for bonding a ferrous metal substrate to rubber is provided wherein a ferrous metal substrate is treated with a solution of a copper salt other than a cupric halide to form a coating of copper, and there is formed on the copper coating an adhesive layer of a polymer comprising 50 - 99X by weight of at least one conjugated diene, 1 - 35% by weight of at least one vinyl-substituted heterocyclic base, and 0 - 35% by weight of one or more polymerizable monomers, to a total of 100%: the rubber can then be bonded to the adhesive layer.
248347
Honny Chemicals Co.
Na
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