C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/196.1
C25D 3/46 (2006.01) C25B 11/04 (2006.01) C25D 5/16 (2006.01)
Patent
CA 1161792
ABSTRACT OF THE DISCLOSURE An electrode is prepared by dispersion-plating a metal layer containing exposed porous particles of Ag on an electrode substrate. If desired, a middle layer is formed between the electrode substrate and the metal layer. The porous particles can be formed by etching an alloy of the particles.
392257
Endoh Eiji
Oda Yoshio
Otouma Hiroshi
Asahi Glass Company Ltd.
Marks & Clerk
LandOfFree
Bonding silver particles in silver coating on electrode... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding silver particles in silver coating on electrode..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding silver particles in silver coating on electrode... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1092339