Bonding substrate with solid adhesives

Details Bonding substrate with solid adhesives Bonding substrate with solid adhesives

B - Operations, Transporting

29

C

B29C 65/52 (2006.01) B32B 7/12 (2006.01) C08J 5/12 (2006.01) C09J 5/06 (2006.01) C08L 73/00 (2006.01)

Patent

CA 2133499

-15- ABSTRACT OF THE DISCLOSURE A process for the bonding of substrates selected from polyvinyl chloride, cellulosic material, metals, polymers of melamine and polymers of phenol is disclosed. A layer of a thermoplastic polymer is interposed between two of the substrates and heated above its melting point. The thermoplastic polymer is a copolymer of ethylene, alkyl acrylate and carbon monoxide. In aspects, polyvinyl chloride to is bonded to cellulosic material at a temperature of less than 90°C to give structures that are useful at temperatures of greater than 100°C. The process is particularly useful in the manufacture of substrates for the manufacture of kitchen cabinets and other furniture. - 15 -

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