Bonding technique for a multi-panel device

Details Bonding technique for a multi-panel device Bonding technique for a multi-panel device

B - Operations, Transporting

60

J

B60J 5/04 (2006.01) B23P 19/00 (2006.01) B29C 65/54 (2006.01) B62D 27/02 (2006.01) F16B 11/00 (2006.01) F16B 5/00 (2006.01)

Patent

CA 2085041

ABSTRACT A method and apparatus are disclosed for bonding a multi-panel device together by injecting a liquid adhesive into a flow channel created by a hem flange located along a perimeter of two contacting panels. The adhesive is then cured and thus forms a permanent bond between the panels.

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