B - Operations – Transporting – 60 – J
Patent
B - Operations, Transporting
60
J
B60J 5/04 (2006.01) B23P 19/00 (2006.01) B29C 65/54 (2006.01) B62D 27/02 (2006.01) F16B 11/00 (2006.01) F16B 5/00 (2006.01)
Patent
CA 2085041
ABSTRACT A method and apparatus are disclosed for bonding a multi-panel device together by injecting a liquid adhesive into a flow channel created by a hem flange located along a perimeter of two contacting panels. The adhesive is then cured and thus forms a permanent bond between the panels.
Freeman Richard Benjamin
Greve Bruce Norman
Borden Ladner Gervais Llp
Budd Company (the)
LandOfFree
Bonding technique for a multi-panel device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding technique for a multi-panel device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding technique for a multi-panel device will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1972705