Bonding tool and its fabrication

Details Bonding tool and its fabrication Bonding tool and its fabrication

H - Electricity

01

L

H01L 21/70 (2006.01) B23K 20/02 (2006.01) H01L 21/603 (2006.01) B23H 9/00 (2006.01)

Patent

CA 2086367

The disclosure is directed to a bonding tool for use primarily in thermo-compression bonding of electronic circuit components and to a method of making the bonding tool. In one form of the disclosure, a holder is provided and has a substrate mounted at an end thereof. The holder is adapted to receive a heating element. A polycrystalline diamond film is disposed on the substrate, the film preferably being deposited by chemical vapor deposition. In a disclosed embodiment the substrate is a material selected from the group consisting of polycrystalline diamond, cemented tungsten carbide, silicon carbide, cubic boron nitride, and tungsten. In a further form of the disclosure, a ceramic substrate is provided which has a favorable thermal conductivity property as well as substantial electrical conductivity sufficient to permit shaping by electrical discharge machining ("EDM").

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