Bonding two surfaces by exposing to actinic radiation an...

Details Bonding two surfaces by exposing to actinic radiation an... Bonding two surfaces by exposing to actinic radiation an...

C - Chemistry, Metallurgy

08

F

154/107.2, 204/9

C08F 2/46 (2006.01) C09J 5/06 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1095850

BONDING TWO SURFACES BY EXPOSING TO ACTINIC RADIATION AN EPOXIDE LIQUID COMPOSITION ABSTRACT OF THE DISCLOSURE A process for bonding surfaces together comprises (i) exposing to actinic radiation a layer of a liquid composition containing an epoxide resin, a photopolymerisable compound, and a heat-activated curing agent for epoxide resins until the composition solidifies to form a film adhesive while the epoxide resin remains substantially heat-curable, (11) sandwiching the film adhesive between the sur- face to be bonded, and (iii) then heating the assembly so that the epoxide resin component of the film adhesive is cured Surfaces which may be so bonded may be metal, glass, ceramic, or wood.

295985

Affiliated with

Also associated with

Rating

Bonding two surfaces by exposing to actinic radiation an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding two surfaces by exposing to actinic radiation an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding two surfaces by exposing to actinic radiation an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-655534