H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/02 (2006.01) B23K 20/00 (2006.01) B23K 20/14 (2006.01) B23K 20/24 (2006.01) B81C 3/00 (2006.01) H01L 21/677 (2006.01)
Patent
CA 2758157
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
La présente invention concerne un procédé de collage multicouche impliquant les étapes suivantes : fabrication d'un premier substrat collé en collant ensemble un substrat supérieur et un substrat intermédiaire à l'intérieur d'une chambre de collage ; apport d'un substrat inférieur pour le premier substrat collé dans la chambre de collage lorsque le premier substrat collé est disposé à l'intérieur de la chambre de collage ; et fabrication d'un second substrat collé en collant ensemble le premier substrat collé et le substrat inférieur à l'intérieur de la chambre de collage. Dans le procédé de collage multicouche, le substrat supérieur peut être collé au substrat inférieur sans être retiré de la chambre de collage après que le substrat supérieur est collé au substrat intermédiaire. Ainsi, le second substrat collé peut être fabriqué à vitesse élevée et à faible coût.
Goto Takayuki
Ide Kensuke
Kinouchi Masato
Suzuki Takenori
Tsuno Takeshi
Mitsubishi Heavy Industries Ltd.
Smart & Biggar
LandOfFree
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