Bubble free film/liquid solder mask-coated printed circuit...

Details Bubble free film/liquid solder mask-coated printed circuit... Bubble free film/liquid solder mask-coated printed circuit...

H - Electricity

05

K

356/1, 154/106,

H05K 3/06 (2006.01) G03F 7/16 (2006.01) H05K 3/28 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2006211

PE-0089 TITLE BUBBLE FREE FILM/LIQUID SOLDER MASK-COATED PRINTED CIRCUIT BOARDS BY FLUID PRESSURIZING ABSTRACT A method is disclosed of obtaining a bubble free laminate employing an intermediate liquid layer by applying uniform fluid pressure after lamination.

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