H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1, 154/106,
H05K 3/06 (2006.01) G03F 7/16 (2006.01) H05K 3/28 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2006211
PE-0089 TITLE BUBBLE FREE FILM/LIQUID SOLDER MASK-COATED PRINTED CIRCUIT BOARDS BY FLUID PRESSURIZING ABSTRACT A method is disclosed of obtaining a bubble free laminate employing an intermediate liquid layer by applying uniform fluid pressure after lamination.
E. I. Du Pont de Nemours And Company
Sim & Mcburney
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