Bubble free liquid solder mask-coated printed circuit boards...

Details Bubble free liquid solder mask-coated printed circuit boards... Bubble free liquid solder mask-coated printed circuit boards...

B - Operations, Transporting

05

D

117/23

B05D 3/12 (2006.01) B05D 5/00 (2006.01) G03F 7/16 (2006.01) H05K 3/28 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2006205

TITLE PE-0108 BUBBLE FREE LIQUID SOLDER MASK-COATED PRINTED CIRCUIT BOARDS BY FLUID PRESSURIZING ABSTRACT A method is disclosed of obtaining a bubble free photosensitive liquid layer and an interface with a substrate by applying uniform fluid pressure after coating the liquid on the substrate.

Affiliated with

Also associated with

Rating

Bubble free liquid solder mask-coated printed circuit boards... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bubble free liquid solder mask-coated printed circuit boards..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bubble free liquid solder mask-coated printed circuit boards... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1846986