Building conditioning technique using phase change materials

Details Building conditioning technique using phase change materials Building conditioning technique using phase change materials

E - Fixed Constructions

04

B

E04B 1/74 (2006.01) C09K 5/06 (2006.01) F24D 11/00 (2006.01) F28D 20/02 (2006.01)

Patent

CA 2270895

The technique of the present invention for minimizing the floor-to-ceiling temperature gradient of a room containing a ceiling, a floor, walls and at least one door and one window, includes the utilization of a phase change material adjacent the ceiling surface and a phase change material adjacent the floor surface. In order to effectively minimize the floor-to-ceiling temperature gradient of the room, first and second phase change materials may be either the same or different, or may be blends of phase change materials. Most preferably the melting temperature of the first phase change material adjacent the ceiling is greater than the crystallization temperature of the second phase change material adjacent the floor. Preferably, the melting temperature of the first phase change material is 25 °C plus or minus 1 °C and the crystallization temperature of the second phase change material is 22 °C plus or minus 1 °C.

Le procédé de cette invention visant à réduire au maximum le gradient thermique plancher - plafond d'une pièce constituée d'un plafond, d'un plancher, de parois ainsi que d'une porte et d'une fenêtre, au moins, repose sur l'utilisation d'un matériau à changement de phase contigu à la surface du plafond et sur celle d'un matériau à changement de phase contigu à la surface du plancher. Il est possible, afin de réduire réellement au maximum le gradient thermique plancher - plafond, d'utiliser des matériaux identiques ou différents ou encore d'employer ces matériaux combinés. Idéalement, la température de fusion du premier matériau à changement de phase contigu au plafond est supérieure à la température de cristallisation du second matériau contigu au plancher et, de préférence, la température de fusion du premier matériau est de 25 DEG C, plus ou moins 1 DEG C, la température de cristallisation du second matériau, étant de 22 DEG C, plus ou moins 1 DEG C.

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