C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/418
C08G 61/08 (2006.01) H01B 3/30 (2006.01) H05K 1/03 (2006.01)
Patent
CA 1339233
Dielectric supports for electronic components, such as circuit boards, are provided which are comprised of two or more bulk polymerized norbornene-type monomers. The monomers may be easily processed into circuit boards, etc. by reaction injection molding. The copolymers obtained exhibit high heat distortion temperatures and good dielectric properties and a balance of properties that make them, for example, well suited for molded wire board materials.
574434
Smith David J.
Tenney Linwood P.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
Smith David J.
Tenney Linwood P.
The B.f. Goodrich Company
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