Bumpless tape automated bonding

Details Bumpless tape automated bonding Bumpless tape automated bonding

H - Electricity

01

L

356/146

H01L 21/607 (2006.01) B23K 20/00 (2006.01) B41J 2/00 (2006.01)

Patent

CA 1284394

ABSTRACT OF THE DISCLOSURE A tape automated bonding method and structure is disclosed. Interconnection using prepatterned metal beam tape interconnect is accomplished by providing vias in passivation layers overlaying a metal region in or on the major surface of the device which is to receive the interconnect leads, eliminating the requirement for bonding pad bumps. Ultrasonic pressure is applied to the beams as they superpose the vias, bonding each lead to its respective metal region.

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