Buried contact devices for nitride-based films and...

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 21/28 (2006.01) H01L 29/20 (2006.01) H01L 29/40 (2006.01) H01S 5/00 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2638191

A semiconductor device comprising: a substrate; a first contact; a first layer of doped semiconductor material deposited on the substrate; a semiconductor junction region deposited on the first layer; a second layer of doped semiconductor material deposited on the junction region, the second layer having opposite semiconductor doping polarity to that of the first layer; and a second contact; wherein the second contact is in electrical communication with the second layer and the first contact is embedded within the semiconductor device between the substrate and the junction region and is in electrical communication with the first layer;; and processes for manufacture of an embedded contact semiconductor device.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Buried contact devices for nitride-based films and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Buried contact devices for nitride-based films and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Buried contact devices for nitride-based films and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1962461

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.