Burn-in apparatus and method

Details Burn-in apparatus and method Burn-in apparatus and method

G - Physics

01

R

G01R 31/26 (2006.01) G01R 31/28 (2006.01) G01R 31/30 (2006.01) G01R 31/309 (2006.01)

Patent

CA 2073899

Abstract of the Disclosure A burn-in apparatus for use in burn-in tests includes a burn-in test container for accommodating a plurality of semiconductor device. Also, the burn-in apparatus includes measuring means for individually measuring junction temperatures of semiconductor chips of the respective semiconductor device by detecting electric characteristics of temperature sensors built in the semiconductor chips, and temperature adjusting means for controlling amounts of heat radiation and conduction of the semiconductor chips. The temperature adjusting means, such as means for controlling air flow rates of air nozzles of the container, is controlled by control means on the basis of outputs of the measuring means. Thus, the junction temperatures can be kept within a predetermined temperature range to thereby improve the accuracy of screening tests.

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