Burn-in apparatus and method

Details Burn-in apparatus and method Burn-in apparatus and method

G - Physics

01

R

G01R 31/26 (2006.01) G01R 31/28 (2006.01) G01R 31/30 (2006.01)

Patent

CA 2073896

Abstract of the Disclosure In placing semiconductor devices as devices-to-be- tested with semiconductor chips incorporated therein in an environment of a set temperature and testing the devices by feeding the semiconductor chips, temperature sensors, such as diodes, are formed beforehand on the semiconductor chips, and during a test, electric characteristics of the temperature sensors (e.g., forward threshold voltages of the diodes) are detected so as to measure temperatures of the semiconductor chips, and based on measured results of the temperatures, environmental temperatures in test container and/or applying voltages to the semiconductor chips are controlled.

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