Burn-in pads for tab interconnect structures

Details Burn-in pads for tab interconnect structures Burn-in pads for tab interconnect structures

H - Electricity

01

L

356/22, 356/9

H01L 23/50 (2006.01) G01R 31/28 (2006.01) H01L 21/66 (2006.01) H01L 23/495 (2006.01) H01L 23/58 (2006.01)

Patent

CA 1303752

BURN-IN PADS FOR TAB INTERCONNECT STRUCTURES Abstract A tape automated bonding tape segment carries on its top surface a printed circuit interconnect conductor high-density array having a plurality of signal, power and ground conductors. Burn-in testing pads are formed on either the top surface o. the bottom surface of the tape segment, or both, and are connected to selected conductors. The testing pads are spaced apart and have a relatively low density to facilitate contact with test equipment, whereby a die connected to the printed circuit array can be tested.

594187

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