Burst-ultrafast laser machining method

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B23K 26/00 (2006.01) B23K 26/06 (2006.01) B23K 26/38 (2006.01) C03B 29/02 (2006.01) C03B 33/08 (2006.01) C03C 23/00 (2006.01) A61F 9/01 (2006.01)

Patent

CA 2332154

A method of laser processing or laser modification of materials. The combination of ultrafast laser pulses and high-repetition rate ( > 100 kHz) bursts (or continuous operation) defines a new and unexpected regime for material processing. The high repetition rate controls thermal and/or other relaxation processes evolving between each ultrafast laser pulse that 'prepares' the sample surface or bulk to alter the interaction with subsequent ultrafast laser pulses and thereby improve or optimize the process, or enable a new process, that are not available at lower repetition rate. The addition of this laser-controlled thermal component, and/or the general control of relaxation processes , overcomes several current limitations of ultrafast laser processing at lower repetition rates ( < 100 kHz), providing means to further harness the many attributes of ultrafast lasers for general material processing and material modification applications.

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