Button rectifier package for non-planar die

Details Button rectifier package for non-planar die Button rectifier package for non-planar die

H - Electricity

05

K

356/58

H05K 1/02 (2006.01) H01L 21/60 (2006.01) H01L 23/051 (2006.01)

Patent

CA 1177580

BUTTON RECTIFIER PACKAGE FOR NON-PLANAR DIE ABSTRACT An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.

393799

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