Capacitance guided assembly of parts

Details Capacitance guided assembly of parts Capacitance guided assembly of parts

B - Operations, Transporting

25

J

341/97

B25J 9/18 (2006.01) B23P 19/00 (2006.01) G05B 19/402 (2006.01)

Patent

CA 1335456

There are disclosed methods and apparatuses for the assembling of parts using capacitive sensing, both for controlling the closure or "homing" phase of the assembly process and for acquiring one or more of the parts prior to that phase.Assembling of semiconductor parts to essentially two-dimensional and three- dimensional packages, the insertion of a peg in a hole, and an application to tape- automated-bonding (TAB) technology are all described, as are various representations of the resulting capacitive data. Included are the uses of scheduling and optical sensing to supplement capacitive sensing in the methods and apparatuses.

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