C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 5/24 (2006.01) C25D 5/54 (2006.01) H05K 1/02 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2162905
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20 % by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10 % by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of a anionic despersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.
Mosolf Charles A.
Polakovic Frank
Thorn Charles Edwin
Electrochemicals Inc.
Ridout & Maybee Llp
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