Carbon dioxide-based fluxing media for non-voc, no-clean...

Details Carbon dioxide-based fluxing media for non-voc, no-clean... Carbon dioxide-based fluxing media for non-voc, no-clean...

B - Operations, Transporting

23

K

B23K 35/363 (2006.01) B23K 35/36 (2006.01) B23K 35/38 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2161155

A flux formulation for use in the assembly of electronic circuit boards having components to be joined by soldering. The formulation comprises a medium which acts as a carrier and solvent for the fluxing agent, which includes in a preferred embodiment supercritical carbon dioxide. The formulation also includes a fluxing agent, being at least partially soluble in the supercritical carbon dioxide which serves to transport the fluxing agent before deposition thereof upon a soldering site. The supercritical fluid is delivered through a nozzle to the circuit board, the supercritical condition being maintained until the supercritical fluid is discharged from the nozzle. The fluxing agent at least partially loses its solubility in the fluid thereupon and is transported to the board by a stream of carbon dioxide gas. Also disclosed is a method for delivering a flux formulation to the electronic circuit board.

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