Card and manufacturing method

Details Card and manufacturing method Card and manufacturing method

G - Physics

06

K

G06K 19/077 (2006.01) H01Q 1/38 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2571835

The invention relates to a card for contactless data and/or energy transmission by means of external devices, containing a multilayer card body which has a substrate layer for accommodating an antenna coil having exposed coil connections on a top side of the substrate layer which are connected in an electrically conductive manner to connections for a chip module containing a chip, the chip being enclosed in a recess in the substrate layer; the windings of the antenna coil extend on the top side of the substrate layer, and a compensation layer extends on the top side of the substrate layer; the compensation layer has a chip module opening for placing the chip module on the substrate layer, and has a bridge opening for the contacting of connections of an antenna bridge which extends transverse to the windings.

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