Card mounted with circuit chip and circuit chip module

B - Operations – Transporting – 42 – D

Patent

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Details

B42D 15/10 (2006.01) G06K 19/07 (2006.01) G06K 19/077 (2006.01)

Patent

CA 2276130

In the processing circuit layer (106) of a card mounted with circuit chip, a processing section which is incorporated with a nonvolatile memory, MODEM circuit, and capacitor, and performs communication processing is constituted. In the constitution of the layer (106), in addition, a coil (44) constituted by forming a metallic wire in a loop-like shape is provided. Since a communicating function is obtained by only using one IC chip (104) in which the processing section and an antenna function are integrated, no wiring is required on the outside of the chip (104). Therefore, no wiring disconnection, etc., occurs. In addition, the assemblage of a card mounted with circuit chip becomes extremely easier. As a result, a highly reliable and inexpensive card mounted with circuit chip can be obtained.

Dans la couche de circuits de traitement (106) d'une carte à puce, on constitue une section de traitement comportant une mémoire non volatile, un circuit MODEM et un condensateur de manière à assurer le traitement de communications. Dans la constitution de la couche, (106) on prévoit en outre une bobine (44) faite d'une boucle de fil métallique. Comme il est possible d'obtenir une fonction de communication en n'utilisant qu'une seule puce (104) intégrant une section de traitement et une fonction d'antenne, il n'est pas nécessaire de prévoir de câblage à l'extérieur de la puce (104). Il ne peut donc pas se produire de déconnexion des fils, etc. En outre le montage de cartes munies de telles puces devient très facile. On obtient ainsi une carte à puce hautement fiable et peu onéreuse.

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