Card mounted with circuit chip and circuit chip module

Details Card mounted with circuit chip and circuit chip module Card mounted with circuit chip and circuit chip module

B - Operations, Transporting

42

D

B42D 15/10 (2006.01) G06K 19/07 (2006.01) G06K 19/077 (2006.01)

Patent

CA 2273949

An IC chip module (74) is formed as two IC chips are brought into contact with each other through an anisotropic conductor (80), because bumps (82, 84) provided in a position opposite to each other are electrically connected. When the module (74) is constituted in such a way, a communicating function is obtained by simply laminating the two IC chips (76 and 78) incorporating processing sections and having antenna functions, and no wiring is required on the outside of the chips (76 and 78). Therefore, the disconnection of wiring does not occur and, at the same time, the module (74) can be assembled extremely easily. In addition, a highly reliable inexpensive card mounted with circuit chip can be provided.

Un module de puces de CI (74) est formé par la mise en contact l'une avec l'autre de deux puces par l'intermédiaire d'un conducteur anisotrope (80), des protubérances (82, 84) formées sur lesdites puces et placées l'une face à l'autre étant ainsi reliées électriquement. Lorsque le module (74) est conçu de cette manière, la fonction de communication est obtenue du seul fait du laminage des deux puces (76 et 78). Ledit module comporte ainsi des sections de traitement et des fonctions d'antenne, sans nécessiter de câblage à l'extérieur des puces (76 et 78). On ne peut donc pas déconnecter le câblage et en même temps, l'assemblage du module (74) est très facile. On obtient en outre une carte à puces peu onéreuse et hautement fiable.

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