H - Electricity – 04 – K
Patent
H - Electricity
04
K
356/8
H04K 3/00 (2006.01)
Patent
CA 1309510
-34- CONTINUOUS CARRIER FILM FOR HEAT FUSIBLE MATERIALS Abstract of the Disclosure A carrier film for heat fusible materials comprises a heat-resistant substrate which is option- ally water-soluble, a water-soluble pressure-sensitive adhesive coated on one surface thereof, and a remov- able release liner. The adhesive releasably retains on the surface of the substract a plurality of bodies of heat fusible material which may be arranged in a predetermined pattern to match the arrangement of printed circuit board or other components desired to be connected. The carrier film may be used to trans- port the bodies of heat fusible material to the de- sired location, and the adhesive functions to retain the in that location and in the predetermined pattern while heat is applied through the substrate to melt the bodies of heat fusible material and provide the desired connections, after which any residual adhes- ive, as well as any residual water-soluble substrate, may be removed using a conventional aqueous bath. The carrier film may advantageously be provides in the form of a continuous tape, along the length of which the predetermined pattern of bodies of heat fusible material may be repeated at appropriate intervals. Method of assembling semiconductor electronic compo- nents utilizing the carrier film are also disclosed.
615008
R. William Wray & Associates
Semi-Alloys Inc.
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