H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/191, 117/26
H01L 21/68 (2006.01) B28D 5/00 (2006.01) H01L 21/00 (2006.01) H01L 21/302 (2006.01) H01L 21/304 (2006.01)
Patent
CA 1244294
CARRIER FILM WITH CONDUCTIVE ADHESIVE FOR DICING OF SEMICONDUCTOR WAFERS Abstract of the Disclosure A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer for bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive. * * * * C-7070/7168
457372
Gowling Lafleur Henderson Llp
National Starch And Chemical Corporation
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