Carrier ring for semiconductor package

Details Carrier ring for semiconductor package Carrier ring for semiconductor package

H - Electricity

01

L

H01L 23/08 (2006.01) H01L 23/00 (2006.01) H01L 23/04 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2101745

2101745 9214263 PCTABS00014 A two-piece carrier ring is provided. First (52) and second (54) rings are affixed to opposing sides of the exterior portion (26) of a leadframe and protect the leads (14) from distortion. The rings (52, 54) are molded prior to bonding to the leadframe so that the rings (52, 54) may be formed from a wide variety of plastics. The premolded rings (52, 54) are polymerized prior to bonding preventing distortion of the leads (14) by shrinking of the rings (52, 54).

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