Carrier socket for leadless integrated circuit devices

H - Electricity – 05 – K

Patent

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339/7

H05K 7/10 (2006.01)

Patent

CA 1155943

A B S T R A C T A carrier socket for leadless chip integrated circuit devices. A flat leadless substrate with a circuit chip thereon is positioned within a housing having spring-loaded contacts mounted therein, each such contact adapted to engage a contact pad on the substrate. A resilient cover engages the housing and holds the substrate against the contacts in a positive manner. The contacts are formed to facilitate electrical connection between the integrated circuit chip and a circuit board. The contacts may be secured to the board by various means such as soldering or planar welding.

376598

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