Carrier tape for electronic circuit elements and method of...

B - Operations – Transporting – 32 – B

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B32B 9/00 (2006.01) B65G 35/04 (2006.01) H05K 13/00 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1322271

CARRIER TAPE FOR ELECTRONIC CIRCUIT ELEMENTS AND METHOD OF MANUFACTURING AN ELECTRONIC CIRCUIT ELEMENT SERIES ABSTRACT OF THE DISCLOSURE A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series. When respective electronic circuit elements are removed from the electronic circuit element series, the adhesive mean sticking to the respective electronic circuit elements are adapted to be also removed from the series. The adhesive means sticking to the respective electronic circuit elements are then heated, through which adhesive means have exhibited adhesion due to heating the respective electronic circuit elements are provisionally held on a printed circuit board. Also, a method of manufacturing an electronic circuit element series is disclosed

558726

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