Casing device

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E - Fixed Constructions

21

B

E21B 17/10 (2006.01) E21B 23/00 (2006.01) E21B 33/127 (2006.01) E21B 43/12 (2006.01)

Patent

CA 2701849

Methods for forming semiconductor devices include providing a textured template, forming a buffer layer over the textured template, forming a substrate layer over the buffer layer, removing the textured template, thereby exposing a surface of the buffer layer, and forming a semiconductor layer over the exposed surface of the buffer layer. In various embodiments, semiconductor structures include a substantially untextured substrate layer, a textured buffer layer disposed over the substrate layer, and a semiconductor layer disposed over the textured buffer layer.

Des procédés de formation de dispositifs à semi-conducteurs comprennent les étapes consistant à préparer un modèle texturé, à former une couche tampon sur le modèle texturé, à former une couche de substrat sur la couche tampon, à retirer le modèle texturé, en exposant ainsi une surface de la couche tampon, puis à former une couche semi-conductrice sur la surface exposée de la couche tampon. Dans divers modes de réalisation, les structures semi-conductrices comprennent une couche de substrat sensiblement non texturée, une couche tampon texturée disposée sur la couche de substrat et une couche semi-conductrice disposée sur la couche tampon texturée.

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