B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
22/166, 356/173
B23K 31/02 (2006.01) B23K 3/06 (2006.01) H01L 21/00 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01)
Patent
CA 1187674
Abstract The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board, and to board flexure. Herein disclosed is a lead for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g., solder material. Also disclosed is a method for casting such a solder lead, and a method for attaching a plurality of cast solder leads to a leadless chip carrier.
422539
Kirby Eades Gale Baker
Western Electric Company Incorporated
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