Catalyst solution for electroless deposition of metal on a...

C - Chemistry – Metallurgy – 23 – C

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6/4, 117/77, 252

C23C 18/28 (2006.01)

Patent

CA 1066688

Abstract of the Disclosure The invention described herein is a catalyst for activating a substrate for the initiation of electroless metal plating and to a process for making the same. The catalyst comprises the product resulting from the admixture of an acid soluble salt of a catalytic metal; the addition product believed to be formed from a solution soluble stannous salt, an acid and urea; and preferably, an extraneous source of halide tons. The catalyst of the invention differs from prior art catalysts in that it has greater stability, does not fume, is lower in cost to make and use and, in the preferred embodiment employing the extraneous source of halide tons, may be operated at lower acidity (high pH) than the prior art catalysts.

201899

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