C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 161/24 (2006.01) B27N 1/02 (2006.01) C08G 12/12 (2006.01) C08L 61/24 (2006.01) C08L 97/02 (2006.01)
Patent
CA 2172902
Disclosed is a binder composition for binding substrates such as wood furnish for particleboard manufacture. The binder comprises a mixture of a first aqueous solution, comprising a buffering salt catalyst and preferably an acid, with a second aqueous solution comprising urea and formaldehyde. Methods of using the buffering salts as catalyst for curing urea-formaldehyde resins are also disclosed.
Daisy Nick K.
Detlefsen William D.
Motter William K.
Borden Inc.
Hexion Specialty Chemicals Inc.
Macrae & Co.
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