C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
6/4, 26/43, 117/
C23C 18/28 (2006.01)
Patent
CA 1037655
ABSTRACT OF THE DISCLOSURE There are provided processes and compositions for the formation of catalytic nuclei on a surface to be metallized, the process comprising treating the surface with a sensitizing solution comprising a copper (I) compound capable of forming ionic solutions of a complex compound and a solvent therefor, the compound and its hydrolysis products having a solubility product so low that they are sparingly soluble or insoluble in water, subsequently rinsing the excess solution from the treated surface with water, thus also hydrolyzing the copper compound and anchoring it firmly to the surface, and thereafter exposing the surface to a reducing agent or agents to form the active nuclei. The process and compositions represent an advance in the state of the art in that the surfaces treated with the sensitizing solution can be rinsed with water without the necessity for an intermediate drying step, and instead of being completely washed off, the compositions are instead anchored firmly to the surface. The process is useful in rendering non-metallic surfaces receptive to the electroless deposition of metal from solution
220503
Kollmorgen Corporation
Na
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