C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/75
C23C 18/30 (2006.01)
Patent
CA 1057596
ABSTRACT A metal (nickel, cobalt, copper or gold) layer if formed on the surface of a body of a polymer by degreasing the surface, forming on the degreased surface a film of a thermally decomposable palladium or platinum complex having the formula LmPdXn or LmPtXn, in which L is a ligand or unsaturated organic group; X is a halogen, an alkyl group or a bidentate ligand, m is an integer from 1 to 4 and n is zero or an integer from 1 to 3, heating the film on the surface to decompose the complex and leave, on the surface, a residue catalytic to an electroless metal-plating bath and then treating the catalysed surface with such a bath. When the polymer is polyethylene terephthalate or polypropylene, the complex is preferably bis-benzonitrile palladium dichloride; 1,3-butadiene palladium dichloride or bis-acetonitrile palladium dichloride and the film is heated at a temperature between 50 and 150°C. When the polymer is polyethylene, the complex is preferably bis-benzonitrile palladium dichloride; 1,3- butadiene palladium dichloride or bis-acetonitrile palladium dichloride and the film is heated at a temperature up to 98°C When the polymer is a polyimide, the complex is preferably bis-trimethyl-phosphite palladium dichloride and the film is heated at a temperature up to 210°C. The film of the complex is preferably formed by applying the complex in solution in a solvent which readily flashes off.
230045
Andrews Daniel M.
Brummett Charles R.
Shaak Ray N.
Amp Incorporated
Na
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