Cathode for vacuum sputtering treatment machine

H - Electricity – 01 – J

Patent

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Details

H01J 37/34 (2006.01)

Patent

CA 2492172

The invention concerns a cathode for vacuum sputtering treatment machine comprising a target plate (2) mounted on a support (3) arranged to act as cooler. The invention is characterized in that the support (3) is secured to a frame (5) defining a closed space (6) for positioning and centering the target (2), said frame (5) including peripherally a profiled catching rim (5d) designed to co-operate with an assembly of independent toe-in elements (8) having complementary catching shapes (8a) adapted to allow a tilting effect of said elements (8) producing a clamping action exerted on members (9), engaged in the thickness of the elements, and supported on part of the catching rim of the frame (5), such that under said tilting effect part of the catching shapes of the assembly of toe-in elements (8), is supported through the front on the peripheral rim of the target (2) for fixing it.

La cathode pour machine de traitement par pulvérisation sous vide comprenant une plaque cible (2) montée sur un support (3) agencé pour faire office de refroidisseur, est remarquable en ce que le support (3) est rendu solidaire d'un cadre (5) délimitant un espace fermé (6) pour le positionnement et le centrage de la cible (2); ledit cadre (5) présentant périphériquement un rebord d'accrochage profilé (5d) apte à coopérer avec un ensemble d'éléments indépendants de pincement (8) présentant des formes d'accrochage complémentaires (8a) aptes à autoriser un effet de basculement desdits éléments (8) résultant d'une action de serrage exercée sur des organes (9), engagés dans l'épaisseur des éléments, et en appui sur une partie du rebord d'accrochage du cadre (5), de sorte que sous ledit effet de basculement une partie des formes d'accrochage de l'ensemble d'éléments de pincement (8), prend appui facialement sur le bord périphérique de la cible (2) en vue de sa fixation.

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