Cathode plate

C - Chemistry – Metallurgy – 25 – C

Patent

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Details

C25C 7/08 (2006.01) C25C 7/02 (2006.01) C25C 1/12 (2006.01)

Patent

CA 2377364

A method of electro-depositing an envelope of metal on a cathode. The metal envelope (120) comprises metal sheets (122, 124) on either side of the cathode plate (100). A groove (150) is provided along one edge of the cathode plate whereby metal deposited on and adjacent to said groove forms a frangible portion (140). The groove is shaped such that a line of weakness (A) is formed in the metal deposited within the groove such that separation of the two sheets of deposited metal is initiated along the line of weakness.

La présente invention concerne un procédé permettant de déposer par électrolyse une enveloppe de métal sur une cathode. L'enveloppe de métal (120) comprend des feuilles métalliques (122, 124) de chaque côté de la plaque de cathode (100). Une rainure (150) est formée le long d'un bord de la plaque de cathode, grâce à laquelle le métal déposé sur la rainure ou à proximité de celle-ci constitue une partie frangible (140). La rainure possède une forme telle qu'une ligne de faiblesse (A) se forme dans le métal déposé à l'intérieur de la rainure, de façon que la séparation des deux feuilles de métal déposé s'opère le long de la ligne de faiblesse.

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