Cationic microgels and their use in electrodeposition

Details Cationic microgels and their use in electrodeposition Cationic microgels and their use in electrodeposition

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08G 59/40 (2006.01) C09D 5/44 (2006.01) C09D 163/00 (2006.01) C09D 179/02 (2006.01) C25D 13/06 (2006.01)

Patent

CA 2044987

A cationic microgel dispersion and the use of the dispersion in the method of cationic electrodeposition is disclosed. The dispersion is prepared by a process comprising dispersing in aqueous medium a mixture of a cationic polyepoxide-amine reaction product and a polyepoxide crosslinking agent and heating the mixture to a temperature sufficient to crosslink the mixture to form said cationic microgel dispersion. The dispersion can be formulated with ungelled cationic resins to form an aqueous resin dispersion which is suitable for use in the process of cationic electrodeposition providing for improved edge coverage and crater control.

Divulgation concernant une dispersion de microgel cationique et l'utilisation de la dispersion dans la méthode d'électrodéposition cationique. La dispersion est préparée par un procédé consistant à disperser, dans un milieu aqueux, un mélange de produit de réaction cationique de polyamine et de polyépoxyde et un polyépoxyde réticulant, et à chauffer le mélange à une température suffisante pour réticuler le mélange et former ladite dispersion de microgel cationique. La dispersion peut être formulée avec des résines cationiques non gélifiées pour former une dispersion de résine aqueuse, utile dans le procédé d'électrodéposition cationique, permettant d'obtenir une couverture améliorée du contour et un meilleur contrôle des cratères.

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