Cement bond analysis

G - Physics – 01 – B

Patent

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G01B 17/02 (2006.01) G01V 1/50 (2006.01) E21B 47/00 (2006.01)

Patent

CA 2674265

A method and apparatus for evaluating a bond between a formation and a tubular. The method includes emitting a shear wave into the tubular, recording the response of the shear wave, and evaluating the response to obtain bond information. The bond information includes bond material (cement) thickness and efficacy of the bond between cement and formation. The method includes studying and utilizing the time lag of the direct wave and wave events, as well as the interference of these waves on a spectral graph. A calibration method is included as well.

L'invention concerne un procédé et un appareil conçus pour évaluer une adhésivité entre une formation et un liant. Le procédé comprend l'émission d'une onde de cisaillement dans le tubulaire, l'enregistrement de la réponse de l'onde de cisaillement, et l'évaluation de la réponse pour obtenir des informations d'adhésivité. Les informations d'adhésivité comprennent l'épaisseur du liant et l'efficacité de l'adhésivité entre le ciment et la formation. Le procédé comprend l'étude et l'utilisation du décalage dans le temps de l'onde directe et des évènements d'onde, ainsi que l'interférence de ces ondes sur un graphique spectral. Un procédé d'étalonnage est également inclus.

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