Ceramic integrated circuit device

Details Ceramic integrated circuit device Ceramic integrated circuit device

H - Electricity

01

L

356/131

H01L 25/16 (2006.01) H01L 23/057 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1180823

ABSTRACT OF THE INVENTION The present invention is directed to an IC device of the ceramic encapsulated type wherein a power supply pulse dampening capacitor is embodied within the IC housing. The device is characterized by the utilization of a chip capacitor bonded to the floor of a recess formed within the housing, which capacitor forms a platform supporting the IC device. Leads between the capacitor and the power supply terminals of the circuit may be maintained at extremely short lengths, whereby inductances are minimized and relatively small capacitors effectively damp power supply pulses.

403558

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