Ceramic microcircuit package

Details Ceramic microcircuit package Ceramic microcircuit package

H - Electricity

01

L

356/143

H01L 23/28 (2006.01) H01L 23/053 (2006.01) H01L 23/66 (2006.01)

Patent

CA 1240409

Abstract A package for housing a microwave or RF microcircuit is disclosed. The package consists of a base and a cover. The base is constructed from a material that has the same thermal expansion coefficient as the microcircuit's substrate material. The base has an electrically conductive surface. The cover is also electrically conductive. The cover is adhered to the conductive surface of the base, thus creating a package enclosure. Inside the package enclosure, the microcircuit is adhered to the conductive surface of the base. RF connectors, attached through the base, provide for transmission of RF signals. DC feed lines, applied to the base, provide for transmission of electrical signals.

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