Ceramic multilayer wiring substrate

Details Ceramic multilayer wiring substrate Ceramic multilayer wiring substrate

H - Electricity

05

K

356/5

H05K 1/03 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 1/11 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2021285

ABSTRACT OF THE DISCLOSURE A ceramic multilayer wiring substrate having a stack of a plurality of ceramic sheets each being formed with through holes which are connected to one another by a conductive paste buried in said through holes. Among the ceramic sheets, those which constitute an intermediate layer portion each is formed with a plurality of parallel through holes which are spaced apart in the direction perpendicular to the direction of thickness of the ceramic sheet. With such through holes, the substrate reduces the resistance in the intermediate layer portion and, therefore, the conduction resistance of the entire through holes.

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