Ceramic substrate

Details Ceramic substrate Ceramic substrate

H - Electricity

05

K

261/24, 356/5

H05K 1/03 (2006.01) C04B 35/18 (2006.01) C04B 35/195 (2006.01) H01B 3/12 (2006.01) H01L 23/15 (2006.01)

Patent

CA 1149517

ABSTRACT OF THE DISCLOSURE A ceramic substrate, suitable for use as a circuit substrate on which chips of integrated circuits are bonded, which consists essentially of, based on the weight of the substrate, 0.5 ~ 5.0% by weight of MgO, and 95.0 ~ 99.5% by weight of the total of Al2O3 and SiO2, the proportion of the Al2O3 to the SiO2 being in the range from 50:50 to 80:20 by weight.

349925

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