Ceramic substrate

Details Ceramic substrate Ceramic substrate

C - Chemistry, Metallurgy

04

B

C04B 35/581 (2006.01) B24B 7/22 (2006.01) B41J 2/335 (2006.01)

Patent

CA 2400852

The circumferential edge portion of a ductile rotating body containing abrasive grains is used to polish the surface of a ceramic substrate. The angle 8 formed between the polished direction D0 of the ceramic substrate and the rotating direction D1 of the rotating body is set in the range from 10° to 80° for the polishing step. Alternatively, the polishing process is divided into at least two steps, and the average grain size of abrasive grains is reduced stepwise in the successive steps of the polishing process. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damage, and a smooth polished ceramic surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0 mm, and the resulting polished ceramic substrate is suitable for a ceramic heater in a thermal fixation device for fixing a toner image.

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