Ceramic substrate polishing method

Details Ceramic substrate polishing method Ceramic substrate polishing method

B - Operations, Transporting

24

B

B24B 1/00 (2006.01) B24B 7/22 (2006.01) B24B 29/00 (2006.01) C04B 35/581 (2006.01) G03G 15/20 (2006.01)

Patent

CA 2266145

A ductile rotating body containing abrasive grains is used, and the surface of a ceramic substrate is polished by the circumferential portion of rotating body. At this time, angle .theta. formed between the polishing direction Do of ceramic substrate and the rotating direction D1 of rotating body is set in the range from 10° to 80° for polishing. Alternatively, the polishing process is divided into at least two steps, and the average grain size of abrasive grains is reduced stepwise for polishing. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damages, and a ceramic surface having a smooth polished surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0mm, and the resulting polished ceramic substrate is suitable for a substrate for a ceramic heater in a thermal fixation device for toner image.

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