Chemical etchant for palladium

C - Chemistry – Metallurgy – 23 – F

Patent

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Details

C23F 1/40 (2006.01) C23F 1/44 (2006.01) H01L 21/306 (2006.01) H01L 21/77 (2006.01)

Patent

CA 2133134

A cyanide based aqueous solution for stripping palladium from copper-containing substrate. The solution includes a cyanide radical source compound, Na2CO3, a nitrobenzoic acid, NaOH, thallium compound, an organo mercapto compound, and water. The presence of the organo mercapto compound in thallium containing cyanide bath permits efficient stripping of palladium from copper containing substrates with minimum corrosion damage to the substrate.

Divulgation d'une solution aqueuse à base de cyanure pour éliminer le palladium d'un substrat contenant du cuivre. La solution comprend un composé source de radicaux cyanures, Na2CO3, un acide nitrobenzoïque, NaOH, un composé du thallium, un composé mercapto-organique et de l'eau. La présence du composé mercapto-organique dans un bain de thallium contenant du cyanure permet l'élimination efficace du palladium de substrats contenant du cuivre, tout en ayant une corrosion minimale du substrat.

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