Chemical mechanical polishing slurry useful for copper...

Details Chemical mechanical polishing slurry useful for copper... Chemical mechanical polishing slurry useful for copper...

C - Chemistry, Metallurgy

09

G

C09G 1/02 (2006.01) C09K 3/14 (2006.01) H01L 21/302 (2006.01) H01L 21/321 (2006.01)

Patent

CA 2324151

A chemical mechanical polishing slurry comprising an oxidizing agent, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, titanium nitride, tantalum and tantalum nitride containing layers from a substrate. The slurry does not include a separate film-forming agent.

L'invention porte sur une pâte à polir chimio-mécanique comprenant un oxydant, un complexeur, un abrasif et un tensio-actif facultatif, et sur son procédé d'utilisation pour éliminer d'un substrat des couches d'alliage de cuivre, de titane, de nitrure de titane, de tantale, ou de nitrure de tantale. Ladite pâte ne contient pas d'agent filmogène séparé.

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