Chemical mechanical polishing systems and methods for their use

Details Chemical mechanical polishing systems and methods for their use Chemical mechanical polishing systems and methods for their use

C - Chemistry, Metallurgy

09

G

C09G 1/02 (2006.01) C09K 3/14 (2006.01) H01L 21/306 (2006.01) H01L 21/321 (2006.01)

Patent

CA 2378771

Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.

La présente invention concerne des compositions et des suspensions de polissage mécanico-chimiques qui contiennent un alpha-aminoacide et servent à polir des substrats comprenant plusieurs couches de métaux ou de métaux et de diélectriques.

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