Chemical peeling of edible plant products

Details Chemical peeling of edible plant products Chemical peeling of edible plant products

A - Human Necessities

23

N

99/173, 130/31

A23N 7/01 (2006.01)

Patent

CA 1048853

ABSTRACT OF THE DISCLOSURE: The outer layers of edible plant products are removed by contacting the products with an aqueous alkaline caustic solution containing from about 1 to 30 weight percent caustic and from 0.05 to 1.00 weight percent, based on the total weight of solution, of an anionic surfactant or mixture thereof corresponding to the formula: Image wherein R is an alkyl or alkaryl group having from 8 to 18 carbon atoms in the alkyl chain, B is hydrogen or R-O-A- and A is either oxyethylene or a mixture of oxyethylene and oxypropylene groups wherein the weight ratio of oxyethylene to oxypropylene is 0.25:1 to 8:1 and the total oxyethylene and/or oxypropylene groups represent from about 30% to 80% of the total weight of the surfactant, said contacting treatment being carried out at a temperature ranging from about 130°F. up to the boiling temperature of the caustic solution.

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